台积电开发人工智能芯片封装技术以对抗英特尔
【台积电开发人工智能芯片封装技术以对抗英特尔】金色财经报道，7月30日，据两位直接了解该项目的人士透露，台积电正在开发一种与英特尔现有技术类似的先进芯片封装技术。这表明，这家全球领先的芯片制造商对来自远距离竞争对手的挑战感到担忧。芯片封装是芯片生产的最后阶段，在这个阶段，将各个硅片组装成一个整体，并将它们连接起来，使它们能够作为一个整体工作，并连接到计算机的其他部分。()
| 排名 | # | 交易平台 | 24H成交额 | 成交涨跌幅 | 活跃度 | 交易平台 | 活跃度 |
|---|---|---|---|---|---|---|---|
| 1 | $183.61亿 | -11.44% | 86.7% | 86.7% | |||
| 2 | $25.76亿 | 0.43% | 68.6% | 68.6% | |||
| 3 | $409.24亿 | -8.02% | 85.4% | 85.4% | |||
| 4 | $9.02亿 | -15.42% | 69.3% | 69.3% | |||
| 5 | $111.30亿 | -6.62% | 65.3% | 65.3% | |||
| 6 | $12.74亿 | -8.44% | 53.3% | 53.3% | |||
| 7 | $2.07亿 | 19.29% | 65.3% | 65.3% | |||
| 8 | $7.48亿 | -8.74% | 68.4% | 68.4% | |||
| 9 | $2.81亿 | -21.3% | 56.9% | 56.9% | |||
| 10 | $73.15亿 | 0.51% | 71.1% | 71.1% | |||
| 11 | $4.32亿 | 5.44% | 36.2% | 36.2% | |||
| 12 | $3,022.36万 | -18.54% | 59.5% | 59.5% | |||
| 13 | $216.33亿 | -0.43% | 31% | 31% | |||
| 14 | $110.33亿 | 1.25% | 76.2% | 76.2% | |||
| 15 | $1.41亿 | -9.63% | 66.9% | 66.9% | |||
| 16 | $106.27亿 | -12.22% | 55.2% | 55.2% | |||
| 17 | $11.92亿 | -6.52% | 26% | 26% | |||
| 18 | $16.51亿 | 27.15% | 46.9% | 46.9% | |||
| 19 | $1.09亿 | -10.5% | 31.5% | 31.5% | |||
| 20 | $1,660.24万 | -21.02% | 58.2% | 58.2% |
